Solderable Polyester Imide Enamelled Round Copper Wire Class H with a Bonding Layer

Product Details
Customization: Available
Insulation Level: N, H, F, B, E, A
Certification: ISO9001, RoHS, VDE
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  • Solderable Polyester Imide Enamelled Round Copper Wire Class H with a Bonding Layer
  • Solderable Polyester Imide Enamelled Round Copper Wire Class H with a Bonding Layer
  • Solderable Polyester Imide Enamelled Round Copper Wire Class H with a Bonding Layer
  • Solderable Polyester Imide Enamelled Round Copper Wire Class H with a Bonding Layer
  • Solderable Polyester Imide Enamelled Round Copper Wire Class H with a Bonding Layer
  • Solderable Polyester Imide Enamelled Round Copper Wire Class H with a Bonding Layer
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Basic Info.

Model NO.
2HBUEW
Application
Transformer, Instrument, Electrical Equipment, Motor
Shape
Round Wire
Conductor Material
Copper Wire
Transport Package
Pallet
Specification
0.01-2.00
Trademark
windoo
Origin
China
HS Code
85441100
Production Capacity
2500t/Year

Packaging & Delivery

Package Size
22.00cm * 22.00cm * 30.00cm
Package Gross Weight
18.000kg

Product Description

0.012 - 0.8mm Self Bonding Wire Self Adhesive Enamelled Copper Winding Wire
Solderable Polyester Imide Enamelled Round Copper Wire Class H with a Bonding Layer
Heat Bonding All bondcoats can be heat bonded, either by oven-heating or by directing hot air on to the wire during winding. In either case, the principle is to heat the winding slightly above the bondcoat's reflow temperature and then cool it below its rated bond strength temperature. Oven bonding is accomplished by heating the coil for a period of time sufficient to obtain uniform heating throughout the winding, followed by a cooling cycle. Heating time is generally 10 to 30 minutes, depending on the size of the winding.
Disadvantages of oven bonding are the longer bonding time as well as the potential need for many winding fixtures. Hot air bonding, though done typically at slower winding speed, has the advantage of the elimination of a secondary bonding operation. This method is cost effective and usually associated with low temperature bondcoats and wire sizes smaller than 34 AWG.
Feature:
Bondcoat uniformity: The distribution and uniformity of the magnet wire bond coat is more consistent and predictable compared to varnish coatings. Most products manufactured utilizing bondable magnet wire, possess greater bond consistency throughout, compared to varnished products. In addition, the finished unit is solidly bonded and may not require any external retaining device, forms, ties, or braces.
Solderable Polyester Imide Enamelled Round Copper Wire Class H with a Bonding Layer
Color

Natrue

Red

Black

Blue

Green

Yellow
Solderable Polyester Imide Enamelled Round Copper Wire Class H with a Bonding Layer

Insulation Film

PE: polyester

UE: Polyurethane

EI: Polyesterimide

AI: polyamideimide

PI: Polyimide

 

Insulation Thickness

Class 1

Class 2

Or according to the customer request

  

Technical standard

GB 6109-2008

IEC 60317-2006

Customer Standard

If you have clear technical standards, please send them to us directly, if not, you can refer to IEC or Chinese standards.

Solderable Polyester Imide Enamelled Round Copper Wire Class H with a Bonding Layer

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